ADLINK Presents An Extreme Rugged PC/104-Plus Single Board Computer With Intel Atom Processor
The full featured, multi-core capable CoreModule 745 delivers the next step forward in rugged, low power embedded systems and stackable platforms
ADLINK Technology Inc. announces the release of its newest small form factor (SFF) rugged single board computer (SBC), the Ampro by ADLINK CoreModule 745. The CoreModule 745 is a PC/104-Plus module that continues ADLINK's ongoing investment in the PC/104 marketplace. Supporting a range of Intel Atom processors from the power efficient N450 running at 1.66GHz to the performance oriented dual-core D510, the CoreModule 745 takes advantage of Atom's two-chip solution architecture with integrated memory and graphics controllers to balance excellent performance with very low power requirements. With a TDP as low as 9W, the CoreModule 745 simplifies cooling requirements and enables conduction cooled solutions for small sealed enclosures in space-constrained applications.
Rugged by design, the CoreModule 745 supports a wealth of legacy I/O interfaces including ISA and PCI buses. Serial ports, one GbE port and up to 2GB of DDR2 667MHz RAM are also incorporated into an expanded PC/104 footprint. This stackable PC/104-Plus SBC allows OEMs in military, avionics, transportation and other rugged markets to add a state-of-the-art Intel Architecture controller to their systems without the need for a custom carrier board. The CoreModule 745 also provides a simple upgrade path for the broad base of existing PC/104 system designs.
"Our customers depend on ADLINK to provide the latest technology as well as legacy support in a ruggedized format that will operate under the most demanding environmental conditions," said Brian Healy, Product Management Manager of ADLINK. "The CoreModule 745 with Intel Atom processor combines an amazing range of I/O and computing capabilities for our OEMs that are developing products for zero-fail applications. With the CoreModule 745, ADLINK once again meets the demanding requirements of military, transportation, avionics, factory floor, and other rugged and extended temperature applications."
SOURCE: ADLINK Technology Inc.