Virtium Technology Exhibiting At Embedded Systems Conference Silicon Valley 2008

Rancho Santa Margarita, CA - Virtium Technology Exhibiting at Embedded Systems Conference Silicon Valley 2008 Experts On-Hand to Discuss DDR3 Technology Used in ECC SO-DIMM, DIMM and MINI-DIMM Products

WHAT:
Virtium Technology Inc., manufacturer of memory modules for specialized computers in demanding environments, will be exhibiting at this year's Embedded Systems Conference & Exhibition.

The company will be demonstrating its broad line of memory products and discussing its in-depth service offerings for embedded systems designers and procurement professionals.

Virtium's own design and engineering experts will be available to educate attendees on DDR3 technology and design techniques. DDR3 DRAM modules use a new fly-by topology for the commands, addresses, control signals, and clocks to improve signaling and sustain memory signal integrity at high speeds. Unlike DDR2 memory, which splits the signal path between all DRAM chips through T-Branching, fly-by topology daisy chains the address and control lines through a single path across each DRAM.

WHEN:
April 14-18, 2008

WHERE:
Embedded Systems Conference Silicon Valley McEnery Convention Center Booth #1844 San Jose, California

WHO:
Virtium Technology manufactures memory products for specialized computers in demanding environments such as embedded computing, military systems, storage, telecommunications and networking. Virtium is the only manufacturer going the extra mile to offer special services that save design engineers and procurement professionals time, money and deliver a worry-free experience.

SOURCE: Virtium Technology