Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced the R-Car V3M Starter Kit to simplify and speed up the development of New Car Assessment Program (NCAP, Note 1) front camera applications, surround view systems, and LiDARs
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, recently announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory
Accenture is reinforcing its commitment to ethical business practices by transforming its Code of Business Ethics for the digital age
Intel recently announced the availability of the Intel Stratix 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2)
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Dibotics, a pioneer and leader in real-time 3D LiDAR processing, recently announced their collaboration to develop an automotive-grade embedded solution for LiDAR processing used in advanced driver assistance systems (ADAS) and automated driving applications
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation and the maker of the industry’s first Universal Flash Storage (UFS) devices, recently announced that it has begun the sampling of new Automotive UFS (JEDEC ver. 2.1 HS-G3) embedded memory solutions
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