TDK Corporation and its Group Companies EPCOS, TDK-Micronas, Tronics and InvenSense will present the industry’s single source of innovative sensor solutions in Booth 416 at the Sensors Expo & Conference 2017, June 28-29, in the McEnery Convention Center, San Jose, Calif
Smart Packaging Solutions, a world leader in eID documents, introduces “Hybrid 8,” its new micro module, for hybrid cards with two chips: one contact and one contactless
Absolute®, the self-healing endpoint security company, has strengthened its technology partnership with Microsoft by integrating with Microsoft Azure Information Protection (AIP), adding persistent visibility to enhance data protection
Fortscale Security Ltd., the pioneer in embeddable behavioral analytics, announced a new patent that moves the user and entity behavior analytics (UEBA) industry forward
MagnaChip Semiconductor Corporation ("MagnaChip" or the "Company") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications, announced today it now offers 0.13 micron BCD process technology integrated with high-density embedded Flash
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, recently announced that it has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications
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