Moortec, providers of complete In-Chip Monitoring PVT Subsystems recently announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.
HPC is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. This increased power consumption requires more electricity and this leads to much higher levels of heat generation. All this energy consumption equates to the costs of successfully implementing HPC easily becoming prohibitive.
As the CPU temperatures rise the power consumption of HPC machine ASIC drastically increases, therefore real time temperature monitoring systems are necessary to allow for power optimization. In-chip embedded temperature sensors help extend device lifetimes and provide protection through the enablement of shutdown schemes, the latter being as a result of rising temperatures from sudden increases in dynamic CPU load profiles.
Companies like MicroBT are meeting these challenges by creating cost effective, highly efficient and functional HPC machines that can deal with the increased level of heat by employing such embedded temperature sensors in areas with known hotspots on the die.
“The quality of the product is very high in all respects. Accurate temperature monitoring and management can enable products to deal with all kinds of challenges in extreme environments. The outstanding performance of Moortec’s solution gives us more confidence to face these types of environments and maintain our high quality in the mass production stage” said Guo Haifeng who is R&D header of MicroBT.
Ramsay Allen, VP of Marketing at Moortec, said “We are excited to be able to support companies like MicroBT who are working in the exciting field of HPC. MicroBT is a major innovator in this ever growing field and we are proud to support their projects with our best-in-class embedded monitoring solutions.”