THERMA-FIN™ Heat Sinks

Therma-Fin™ heat sinks utilize folded fin technology, increasing the surface area of the heat sink to more efficiently disperse heat.

The thermal requirements of many RF Amplifiers and Laser Diodes require a high performance cooling solution. Aluminum extrusions are often too bulky or do not meet the performance requirements needed. This trend is forcing a fundamental shift in the supply base for volume heat sinks. Thermacore's lighter, smaller, and more efficient folded fin heat sinks and heat pipe assemblies fulfill this need.

Therma-Fin™ utilizes Thermacore's new folded fin technology to maximize surface area, thus increasing the flow of heat from the component into the air. Aluminum or copper fins can be epoxied to the cooling plate or soldered/brazed to increase reliability and minimize thermal resistance. Base options include Therma-Base™ vapor chambers, copper bases, aluminum bases, and copper or aluminum bases with embedded heat pipes.

Therma-Fin's™ superior thermal performance allows fans in the system to run at a lower speed for quieter operation and increased reliability. Thermacore's patented open top production process can allow for impingement type airflow. Multiple mounting options, including through-holes and clip designs, are available to facilitate attachment to the component.

Thermacore International, Inc., 780 Eden Road, Lancaster, PA 17601. Tel: 717-569-6551; Fax: 717-569-8424.