Latest Headlines
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ADLINK Releases Intel® Core™ Ultra-Powered COM Express Module With Integrated CPU+GPU+NPU Providing Up To 50% In Power Saving
12/14/2023
Integrating up to 8 Xe-cores (128 EUs), an NPU, and 14 CPU cores (6P+8E) at 28W TDP, the Intel Core Ultra-powered COM Express module — cExpress-MTL — offers 1.9x the GPU performance than previous generation and dedicated AI acceleration with lowered power consumption.
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Embedur Inc Joins Tinyml Foundation As A Platinum Strategic Partner
12/13/2023
embedUR Inc., a leader in embedded systems specializing in Wi-Fi and IoT, proudly announces it has joined the TinyML Foundation as a Platinum Strategic Partner. This alliance underscores our unwavering dedication to advancing the future of tinyML and enhancing edge intelligence for billions of small, connected-devices around the world.
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ADATA Industrial Releases SATA 31D Series Industrial-Grade SSDs
12/11/2023
ADATA Industrial, the world's leading brand for industrial-grade embedded storage, officially released today its SATA 31D series of industrial-grade solid-state drives including 2.5-inch ISSS31D, M.2 2280 IM2S31D8, and M.2 2242 IM2S31D4, designed for retail terminals and embedded systems.
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Sibros Partners With Accolade Electronics To Deliver Value-Added Embedded Hardware Systems Bolstered By RTOS Integration
11/30/2023
Connected vehicle technology company Sibros today announced a strategic partnership with Accolade Electronics, the largest provider of connected telematics solutions in India with over 800K connected devices currently deployed and successfully running on numerous vehicle models, to further enhance the capabilities of connected vehicles.
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Microchip Expands Development Ecosystem With MPLAB XC-DSC Compiler With Flexible Licensing Options
11/14/2023
With the rapid growth of the industrial and autonomous vehicles markets, there is an ever-increasing demand for software tools that enable faster and more efficient coding and debugging in real-time control applications.
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AMD Expands Ryzen Embedded Processor Family For High-Performance Industrial Automation, Machine Vision And Edge Applications
11/14/2023
AMD today announced at Smart Production Solutions 2023 the AMD Ryzen™ Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining “Zen 4” architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market.
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ERS Electronic Introduces 'High Power Dissipation' Thermal Chuck System, Which Can Dissipate Up To 2.5kW At -40°C For Embedded Processors, DRAM And NAND Wafer Test
11/14/2023
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System. The technology enables accurate and powerful temperature control of a DUT while performing tests of high-end CPUs, GPUs, and high parallelism DRAM devices in the temperature range between -60°C and +200°C.
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Pushing Data Storage Boundaries: Cervoz Debuts M.2 2230 (A+E Key) NVMe SSD For Edge AI In Ultra-Compact PCs
11/1/2023
Cervoz Technology, a leading provider of industrial-grade storage and memory solutions, is proud to introduce the T425 SSD, supporting a wide temperature operating range of -40°C to 85°C.
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ADLINK Technology Receives 2023 IoT Edge Computing Excellence Award From IoT Evolution World
10/31/2023
- ROScube-X RQX-59 Series has won the 2023 IoT Edge Computing Excellence Award.
- The ROScube is an incredibly versatile robotic controller family created specifically for AI-powered robotics, seamlessly integrating with ROS 2 and its vast ecosystem, which is the perfect choice for AMR and autonomous driving solutions.
- The award-winning RQX-59 Series is powered by NVIDIA® Jetson AGX Orin™ modules and can synchronize frames from LiDAR and a maximum of 8 GMSL2/FPD-Link III cameras.
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The Standard Performance Evaluation Corporation Welcomes EEMBC As The New Embedded Group
10/30/2023
The Standard Performance Evaluation Corporation (SPEC), the trusted global leader in computing benchmarks, today announced that EEMBC, the 25-year-old Embedded Microprocessor Benchmark Consortium, has become SPEC’s new Embedded Group (SPEC EG).