Product/Service

Ball Grid Array & Chip Scale Prototyping Package

Source: Emulation Technology, Inc.
Ball Grid Array (BGA) & Chip Scale Package (CSP) prototyping adapter boards allow designers to easily add 1.27, 1.00 and .8 mm pitch BGA's to their prototype breadboards
Emulation Technology, Inc.rray (BGA) & Chip Scale Package (CSP) prototyping adapter boards allow designers to easily add 1.27, 1.00 and .8 mm pitch BGA's to their prototype breadboards. These BGA/CSPs are smaller, faster and provide new solutions for design, debug, and test. For testing, designers plug the adapter onto a prototyping board with a 2.54mm center grid, surface mount the IC to the board and the prototype is operable. Extra jumper pads are included for custom wiring and circuitry.

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