LATEST HEADLINES

• Saelig Introduces Rugged Fanless 8^th/9^th Gen iCore Amplicon Impact-E 280DIO Controllers

  The Impact-E 280DIO series is a compact, low power embedded system, utilizing Intel 8th and 9th generation mobile iCore processing technology to achieve high processing power with minimal power draw and multiple IO features.

• Low-Power COM Express Module With AMD Ryzen Embedded V1000/R1000 SoC

  IBASE Technology Inc., a leading provider of industrial motherboards and embedded solutions, announces the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen Embedded SoC to enable next-generation embedded designs.

• Dialog Semiconductor Licenses Its Non-Volatile Resistive RAM Technology To GLOBALFOUNDRIES For 22FDX Platform, Targeting IoT And AI

  DIALOG SEMICONDUCTOR (XETRA:DLG), a leading provider of battery and power management, Wi-Fi® and Bluetooth® low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES.

• NXP Announces Expansion Of Its Scalable Machine Learning Portfolio And Capabilities

  NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that it is enhancing its machine learning development environment and product portfolio.

• Innodisk Brings Fail-Safe Remote Management To IoT Solutions With New ASUS Partnership

  On Oct. 15, Innodisk and ASUS announced a new strategic partnership between the two companies.

• OMRON Launches B5L Series Embedded TOF Sensor Module With Three-Dimensional Distance Measurement Capability Of People And Objects

  OMRON Corporation, based in Kyoto, Japan, has announced that it began selling the B5L Series embedded 3D TOF Sensor Module in Japan from September 1 and globally from October 1.