BGA Production Socket
Source: Emulation Technology, Inc.
A new line of Ball Grid Array (BGA) prototyping and production sockets was created to give designers a more reliable method for installing BGA packages in prototype and production systems
Emulation Technology, Inc.of Ball Grid Array (BGA) prototyping and production sockets was created to give designers a more reliable method for installing BGA packages in prototype and production systems.
The BGA socket design has a horizontal clearance of 6mm and a vertical clearance of less than 10mm. These new sockets are also available in a Zero Insertion Force (ZIF) version for quick insertion and removal of the chip and a "raised SMD", version which raises the height of the socket to gain clearance over adjacent components. The sockets enable multiple chip testing of up to 5,000 insertions.
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