Printed Circuit Board Backplane Interconnect
Source: Thomas & Betts Corporation
The printed circuit board backplane interconnect with a signal-to-ground ratio of 8:1 achieves signal speeds higher than three Gigabits per second with no measurable crosstalk
Thomas & Betts Corporation circuit board backplane interconnect with a signal-to-ground ratio of 8:1 achieves signal speeds higher than three Gigabits per second with no measurable crosstalk. The interconnect system, designated MPI>SI (Side Interface), brings the traces on the daughtercard to the narrow side of Thomas & Betts Corporation circuit board before connecting them directly to the backplane with a grid of MPI columns. Incorporating the company's MPI (metallized particle interconnect) technology into the side of a standard daughtercard doubles the contact density per row and eliminates mechanical connectors from the backplane entirely. The system uses the trace ends on the side of the daughtercard to initiate the electrical connection. The connector consists of an array of MPI columns that mate with these trace ends along the thin side of the card and with the SMT pads printed on the backplane. With the MPI connector in between, the daughtercard is mounted perpendicularly to the backplane with special compression hardware to complete the interconnection.
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