Thermacore Therma-Fin Heatsinks

Therma-Fin heat sinks (front) enable chips to run cooler than extruded heat sinks
Thermacore's Therma-Fin heat sinks utilize folded fin technology to maximize surface area, thus increasing the flow of heat from the processor to the air. Brazed attachment of the fins to the base eliminates any chance of cracks forming over time, as can happen with an epoxy bond. Therma-Fin heat sinks are light weight yet provide superior performance, allowing the fan to run at a lower speed for quiet and reliable operation.

Custom Therma-Fin Cooling solutions are available for the Power Semiconductor, Communications, and Computer industries. Standard products are currently available for microprocessor cooling.

Custom Therma-Fin Design Guidelines

Standard Products for Microprocessor Cooling

• Pentium 4 Therma-Fin Fansink Cooling Solution

• AMD Athlon Therma-Fin Fansink Cooling Solution

• Pentium III Therma-Fin Fansink Cooling Solution

• Pentium 4 Passive Heat Sink Cooling Solution

Thermacore International, Inc., 780 Eden Road, Lancaster, PA 17601. Tel: 717-569-6551; Fax: 717-569-8424.