Ultra FineLine BGA Technology
Source: Altera Corporation
49-pin and 169-pin Ultra FineLine BGA packaging is being shipped for MAX 7000 programmable logic devices (PLDs)
Altera Corporationn and 169-pin Ultra FineLine BGA packaging is being shipped for MAX 7000 programmable logic devices (PLDs). MAX 7000B device is a 2.5-volt P-Term device available in an Ultra FineLine BGA package, featuring a 0.8mm pitch (distance between two balls), which allows more pins to be placed in a smaller footprint. The 169-pin Ultra FineLine BGA package requires 11 square mm of board space. The BGA packages are ideal for applications that require minimal board space and low-power consumption, such as DSL modems, next-generation cell phone infrastructure, radio handsets, and advanced storage systems.
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