Latest Headlines

  1. Diamond Technologies, Inc. Expands Embedding Computing Portfolio With DEC i.MX 91, DEC i.MX 93, And DEC MP2 Embedded OSM Computing Modules 11/20/2025

    Diamond Technologies, Inc. (DTI), a leading provider of embedded solutions to OEMs, today announced the availability of three new additions to its growing line of embedded computing modules: the DEC i.MX 91-OSM, DEC i.MX 93-OSM, and the DEC MP2-OSM embedded computing modules.

  2. SecEdge Unveils Embedded TPM For NXP i.MX 6, 7, 8 And 9 Series Applications Processors 11/19/2025

    SecEdge, a leader in digital security for edge devices, today announced the availability of its SEC-TPM foundational device security solution for NXP Semiconductors i.MX 6, 7, 8 and 9 series of applications processors.

  3. Neousys Presents Rugged Edge AI Platforms Powering Robots And Automation At iREX 2025 11/19/2025

    Neousys Technology, an industry-leading provider of rugged embedded systems, will showcase its latest rugged AI computing platforms powered by NVIDIA Jetson, along with AMD- and Intel®-based fanless embedded computers, at iREX 2025, booth W2-38 from 12/3 - 12/6 at Tokyo Big Sight.

  4. congatec And Qualcomm Collaborate To Drive The Next Technology Wave With High-Performance Qualcomm Dragonwing Platforms 11/18/2025

    congatec – a leading vendor of embedded and edge computing technology – today announced a technology collaboration with Qualcomm Technologies, Inc. that will speed the commercialization of high-performance embedded edge AI applications for size, power, and weight (SWaP) constrained industrial products based on Qualcomm Dragonwing processors.

  5. STMicroelectronics Introduces The Industry's First 18nm Microcontroller For High-Performance Applications 11/18/2025

    STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled the STM32V8, a new generation of high-performance microcontrollers (MCUs) for demanding industrial applications.

  6. MicroEJ And Boon Logic Partner To Simplify Edge AI With Unsupervised Learning For All Embedded Devices 11/17/2025

    MicroEJ, a global leader in embedded software, in partnership with Boon Logic, provider of the world’s fastest AI-based anomaly detection solutions, today announced PicoAI, a new software component designed to bring self-learning artificial intelligence to any smart connected devices, eliminating the need for cloud infrastructure and costly training data collection.

  7. Launch Of Grinn SBC Gives Developers New Way To Get Sophisticated AI-Ready Embedded Systems To Market In Months Not Years 11/4/2025

    Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, today launched a compact but powerful single-board computer (SBC) which will help embedded device manufacturers to meet the mounting pressure to take sophisticated and AI-ready new products to market quickly.

  8. Analog Devices Unveils CodeFusion Studio™ 2.0 To Simplify And Accelerate Embedded AI Development 11/3/2025

    Analog Devices, Inc. (Nasdaq: ADI), a global leader in semiconductor innovation, today launched CodeFusion Studio™ 2.0, a significant upgrade to its open source embedded development platform.

  9. ANAFLASH Advances Embedded FLASH Memory For Next-Generation Smart Edge Devices With Samsung Foundry 11/3/2025

    ANAFLASH, an edge AI processor startup, has developed an AI MCU with its proprietary standard logic compatible embedded flash technology using Samsung Foundry’s 28 nm process.

  10. Kontron Launches New Distribution Strategy And Gains Broadest Embedded Module Roadmap In The Western Hemisphere 11/3/2025

    Today Kontron, a global leader in IoT and embedded computing technology, announced a bold new direction in its U.S. distribution strategy designed to strengthen customer access, enhance service capability, and focus on its growth markets, aerospace, defense, medical, and industrial.