Latest Headlines

  1. ModelNova Revolutionizes AI Application Development For Small Devices 6/25/2024

    From the TinyML Summit in Milan Italy, embedUR systems Inc., a leader in embedded systems and Edge AI, and a TinyML sponsor partner, is thrilled to announce the launch of ModelNova, a groundbreaking software hub catering for Edge AI solutions.

  2. Quicklogic To Exhibit At DAC 2024: Showcasing EFPGA Technology And Australis™ Hard IP Generator 6/20/2024

    QuickLogic Corporation, a developer of embedded FPGA (eFPGA) Hard IP, ruggedized FPGAs and endpoint AI solutions is excited to announce its participation in the DAC, the Chips to Systems Conference, in San Francisco. Visit us at Booth #2358 to explore our cutting-edge technologies and innovative solutions

  3. Primemas Selects Achronix Embedded FPGA Technology For System-On-Chip (SoC) Hub Chiplet Platform 6/19/2024

    Achronix, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, and Primemas, a fabless semiconductor company developing an innovative SoC Hub Chiplet (Hublet) platform using chiplet technology, today announced a collaboration to bring FPGA programmability to the Primemas suite of products.

  4. Eviden Announces SICS ALAT, The Combat Information System Of The SCORPION Program, To Be Embedded In The Aircraft Of The French Army Light Aviation By 2026 6/17/2024

    Eviden, the Atos Group business leading in digital, cloud, big data and security, today announces that the French Defense Procurement Agency (DGA), via the Defense Digital Agency (AND), has entrusted it with the development and deployment of SICS1 ALAT2. 

  5. Actian Launches Zen 16.0, The Next Generation Database For Edge Computing 6/17/2024

    Actian, the data and analytics division of HCLSoftware, today announced the launch of Actian Zen 16.0, the newest version of its innovative embedded database. To help businesses run faster, smarter applications on the edge, Zen 16.0 is designed for real-time data processing across mobile, IoT devices, edge gateways, and complex machinery.

  6. Maris Tech Collaborates With Lightpath For AI-Ready Infrared Cameras 6/12/2024

    Maris-Tech Ltd. ("Maris-Tech" or the "Company"), a B2B provider of edge computing artificial intelligence ("AI") accelerated video solutions for edge platforms, today announced a collaboration with LightPath's ("LightPath") in which Maris-tech integrated critical firmware and hardware to support AI algorithms embedded in LightPath's infrared cameras, completing a significant step in the evolution of LightPath's technology with the support of AI accelerated hardware, software and algorithms in all its infrared cameras.

  7. Computer Industry Joins NVIDIA To Build AI Factories And Data Centers For The Next Industrial Revolution 6/2/2024

    COMPUTEX -- NVIDIA and the world’s top computer manufacturers today unveiled an array of NVIDIA Blackwell architecture-powered systems featuring Grace CPUs, NVIDIA networking and infrastructure for enterprises to build AI factories and data centers to drive the next wave of generative AI breakthroughs.

  8. Exascend Launches Rugged AS500 BGA SSD For Next-Generation Autonomous Vehicles 5/16/2024

    Exascend, a service-oriented provider of innovative storage and memory solutions, today unveiled its AS500 series NVMe Ball Grid Array solid state drive (BGA SSD). Engineered to address the demanding data storage requirements of next-generation connected and autonomous vehicles, the AS500 combines exceptional endurance with virtualization capabilities in an ultra-compact BGA form factor.

  9. Viking Technology Introduces Industry's Highest Density 16GB DDR4 Multi-Chip Package (MCP) 5/16/2024

    Viking Technology, a division of Sanmina Corporation, announces their newly released 16GB DDR4 Multi-Chip Package (MCP). This high-density MCP is engineered to excel in embedded systems and rugged applications, setting new standards for performance, efficiency, and compactness in demanding environments.

  10. Andes, Hirain, And Hpmicro Join Hands To Build RISC-V AUTOSAR Software Ecosystem 5/15/2024

    Andes, HiRain, and HPMicro jointly announced that the three parties will cooperate to combine the AndesCoreTM RISC-V processor series, the HPMicro HPM6200 full line of products, and the HiRain Vehicle OS software platform solutions to jointly build the RISC-V ecosystem in the field of automotive electronics.