Latest Headlines

  1. Winbond Launches 8Gb DDR4 DRAM Built On Advanced 16nm Process Technology For Industrial And Embedded Applications 12/11/2025

    Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, developed using Winbond's in-house advanced 16nm process technology, delivering higher speed, lower power consumption, and better cost efficiency solution for TV, servers, networking, industrial PCs, and embedded applications.

  2. Virtusa Acquires SmartSoC Solutions, Establishing Full-Stack Service Offering From Chip To Cloud And Driving Expansion Into The Semiconductor Industry 12/10/2025

    Virtusa Corporation, a global product and platform engineering services company, today announced the strategic acquisition of SmartSoC Solutions (SmartSoC), a leader in semiconductor engineering and integrated circuit (IC) design services.

  3. Abaco Systems Launches The VP241 A SOSA Aligned 3U VPX FPGA Carrier Card Featuring AMD Versal Prime Series System-On-Module 12/9/2025

    Abaco Systems announces the VP241, a groundbreaking SOSA aligned 3U VPX FPGA carrier card designed to deliver unmatched flexibility for next-generation embedded computing applications.

  4. QNX To Showcase Innovations For Software-Defined Vehicles And Mission-Critical Embedded Systems At CES 2026 12/8/2025

    QNX, a division of BlackBerry Limited , has announced it will showcase the latest advancements in its mission-critical embedded systems and automotive software product portfolio, including a new demo of its Foundational Vehicle Software Platform developed in collaboration with Vector, at CES 2026.

  5. albatron.ai Announces TALO-25000: A Rugged, Wide-Temperature Embedded AI Computing System Powered by NVIDIA Jetson AGX Orin 12/5/2025

    albatron.ai today announced the launch of its first embedded AI computing system, the TALO-25000, powered by the NVIDIA Jetson AGX Orin platform. Designed with rugged reliability and high compute density, the TALO-25000 delivers exceptional edge AI performance for mission-critical industrial applications.

  6. Aetina Launches Industrial MXM Powered By NVIDIA Blackwell Platform, Empowering AMR, Manufacturing And Medical AI 12/4/2025

    Aetina Corporation, a leading provider of Edge AI solutions, has announced the launch of its next-generation MXM AI Accelerator Module series accelerated by NVIDIA RTX PRO Blackwell Embedded GPUs, which is part of its CoreEdge MXM AI Module family.

  7. Tria Technologies To Bring Qualcomm Dragonwing IQ-6 Series To Market With Two New Compute Modules 12/3/2025

    Tria Technologies, an Avnet company specializing in the manufacturing of embedded compute boards, has introduced the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ-615 modules, marking commercial availability of computer-on-module (COM) worldwide featuring a Qualcomm Dragonwing IQ-615 processor.

  8. SEGGER Introduces emApps For Embedded Systems 12/1/2025

    "emApps is a revolutionary software package that brings the familiar flexibility of the smartphone to the world of embedded systems," says Rolf Segger, Founder of SEGGER. "Apps add capabilities to embedded devices, while keeping firmware small.

  9. Kaspersky Enhances Embedded Systems Security With Stronger Behavioral Defenses And Anti-Ransomware Capabilities 11/26/2025

    Embedded devices – from ATMs and point-of-sale systems to computerized medical equipment – which offer quick rewards through both direct financial gain and access to valuable sensitive data – have become regular targets for cybercriminals.

  10. congatec Takes Embedded ARM Modules To A New Level Of Performance 11/26/2025

    congatec – a leading vendor of embedded and edge computing technology – launched its first COM-HPC Mini Computer-on-Module (COM) powered by the Qualcomm Dragonwing IQ-X Series processors.