Latest Headlines
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IM Launches A New Generation Of eMMC For Industrial Applications
2/12/2026
As many memory manufacturers discontinue their eMMC product lines, Intelligent Memory, a manufacturer of industrial-grade memory product solutions, launches a new, low-density eMMC product line.
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AAEON Announces The De Next-RAP8-EZBOX, The World's Smallest, Lightest 13th Gen Intel Core-Powered Embedded System
2/12/2026
Edge computing leader AAEON, today announced another breakthrough with the release of the de next-RAP8-EZBOX, the world’s smallest embedded PC powered by 13th Generation Intel Core Processors.
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Invitation To Meet IBASE At Embedded World 2026
2/11/2026
Embedded World, the leading global event for the embedded community, is just around the corner. IBASE warmly invites you to visit us in Nuremberg from March 10 to 12.
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Production-Ready, Full-Stack Edge AI Solutions Turn Microchip's MCUs And MPUs Into Catalysts For Intelligent Real-Time Decision-Making
2/10/2026
A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for real-time inferencing and decision-making applications in today’s industrial, automotive, data center and consumer Internet of Things (IoT) networks.
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Empower Introduces High-Density Embedded Silicon Capacitors To Advance Next-Generation AI And HPC Performance
2/10/2026
Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAP), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors.
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Cisco Announces New Silicon One G300, Advanced Systems And Optics To Power And Scale AI Data Centers For The Agentic Era
2/10/2026
Cisco continues to transform the network into an AI innovation platform, today unveiling the Silicon One G300, a 102.4 Tbps switching silicon designed for massive AI cluster buildouts.
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Zephyr Project Welcomes Beagleboard.Org, Chengdu Jingrong Lianchuang Technology, Embedd, Openeuler, Savoir-Faire Linux, Sevenlab And Schneider Electric To Its Growing Ecosystem
2/5/2026
Today, the Zephyr Project announced that Chengdu Jingrong Lianchuang Technology, Embedd, Savoir-faire Linux, SevenLab and Schneider Electric have joined the ecosystem as Silver members. Additionally, BeagleBoard.org and openEuler have expanded their collaboration with Zephyr by becoming Associate members to foster deeper collaboration across embedded and edge computing communities.
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Texas Instruments To Acquire Silicon Labs
2/4/2026
Texas Instruments (Nasdaq: TXN), a global semiconductor company that designs, manufactures and sells analog and embedded processing chips, and Silicon Labs (Nasdaq: SLAB), a leader in secure, intelligent wireless technology, today announced they have signed a definitive agreement under which Texas Instruments will acquire Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.
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Variscite Launches SMARC-Compatible SoM Portfolio With VAR-SMARC-MX8M-PLUS
1/29/2026
Variscite, a global leader in System on Module design and manufacturing, is introducing a new series of modules conforming to the Smart Mobility Architecture (SMARC) standard.
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Congatec Expands Penang R&D Presence, Anchoring High-Value Embedded Computing Capabilities In Malaysia
1/26/2026
congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia.