congatec – a leading vendor of embedded and edge computing technology – significantly broadens the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.
Parasoft, a global leader in automated software testing for over 30 years, today announced the 2020.2 release of Parasoft C/C++test, the unified C and C++ development testing solution for embedded applications.
Sectigo®, a leading provider of automated digital identity management, embedded security, and web security solutions, and Green Hills Software, the worldwide leader in high-assurance operating systems, today announce a global reseller agreement.
The Impact-E 280DIO series is a compact, low power embedded system, utilizing Intel 8th and 9th generation mobile iCore processing technology to achieve high processing power with minimal power draw and multiple IO features.
IBASE Technology Inc., a leading provider of industrial motherboards and embedded solutions, announces the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen Embedded SoC to enable next-generation embedded designs.
DIALOG SEMICONDUCTOR (XETRA:DLG), a leading provider of battery and power management, Wi-Fi® and Bluetooth® low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES.