Latest Headlines

31. Aetina Launches Industrial MXM Powered By NVIDIA Blackwell Platform, Empowering AMR, Manufacturing And Medical AI 12/4/2025

    Aetina Corporation, a leading provider of Edge AI solutions, has announced the launch of its next-generation MXM AI Accelerator Module series accelerated by NVIDIA RTX PRO Blackwell Embedded GPUs, which is part of its CoreEdge MXM AI Module family.

32. Tria Technologies To Bring Qualcomm Dragonwing IQ-6 Series To Market With Two New Compute Modules 12/3/2025

    Tria Technologies, an Avnet company specializing in the manufacturing of embedded compute boards, has introduced the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ-615 modules, marking commercial availability of computer-on-module (COM) worldwide featuring a Qualcomm Dragonwing IQ-615 processor.

33. SEGGER Introduces emApps For Embedded Systems 12/1/2025

    "emApps is a revolutionary software package that brings the familiar flexibility of the smartphone to the world of embedded systems," says Rolf Segger, Founder of SEGGER. "Apps add capabilities to embedded devices, while keeping firmware small.

34. Kaspersky Enhances Embedded Systems Security With Stronger Behavioral Defenses And Anti-Ransomware Capabilities 11/26/2025

    Embedded devices – from ATMs and point-of-sale systems to computerized medical equipment – which offer quick rewards through both direct financial gain and access to valuable sensitive data – have become regular targets for cybercriminals.

35. congatec Takes Embedded ARM Modules To A New Level Of Performance 11/26/2025

    congatec – a leading vendor of embedded and edge computing technology – launched its first COM-HPC Mini Computer-on-Module (COM) powered by the Qualcomm Dragonwing IQ-X Series processors.

36. Diamond Technologies, Inc. Expands Embedding Computing Portfolio With DEC i.MX 91, DEC i.MX 93, And DEC MP2 Embedded OSM Computing Modules 11/20/2025

    Diamond Technologies, Inc. (DTI), a leading provider of embedded solutions to OEMs, today announced the availability of three new additions to its growing line of embedded computing modules: the DEC i.MX 91-OSM, DEC i.MX 93-OSM, and the DEC MP2-OSM embedded computing modules.

37. SecEdge Unveils Embedded TPM For NXP i.MX 6, 7, 8 And 9 Series Applications Processors 11/19/2025

    SecEdge, a leader in digital security for edge devices, today announced the availability of its SEC-TPM foundational device security solution for NXP Semiconductors i.MX 6, 7, 8 and 9 series of applications processors.

38. Neousys Presents Rugged Edge AI Platforms Powering Robots And Automation At iREX 2025 11/19/2025

    Neousys Technology, an industry-leading provider of rugged embedded systems, will showcase its latest rugged AI computing platforms powered by NVIDIA Jetson, along with AMD- and Intel®-based fanless embedded computers, at iREX 2025, booth W2-38 from 12/3 - 12/6 at Tokyo Big Sight.

39. congatec And Qualcomm Collaborate To Drive The Next Technology Wave With High-Performance Qualcomm Dragonwing Platforms 11/18/2025

    congatec – a leading vendor of embedded and edge computing technology – today announced a technology collaboration with Qualcomm Technologies, Inc. that will speed the commercialization of high-performance embedded edge AI applications for size, power, and weight (SWaP) constrained industrial products based on Qualcomm Dragonwing processors.

40. STMicroelectronics Introduces The Industry's First 18nm Microcontroller For High-Performance Applications 11/18/2025

    STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled the STM32V8, a new generation of high-performance microcontrollers (MCUs) for demanding industrial applications.