Latest Headlines

  1. Unity And HERE Collaborate On Real-Time 3D In-Vehicle Experiences 3/24/2021

    Unity, the world’s leading platform for creating and operating real-time 3D (RT3D) content, today announced a collaborative agreement with HERE Technologies, the leading location data and technology platform, to partner on developing next-generation embedded automotive HMIs with state-of-the-art, RT3D rendering capabilities

  2. CEVA Unveils MotionEngine® Scout, A Highly-Accurate Dead Reckoning Software Solution For Indoor Autonomous Robots 3/24/2021

    CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today unveiled the Hillcrest Labs MotionEngine™ Scout, a highly accurate dead reckoning software solution for intelligent navigation systems in indoor robots including robot cleaners and Autonomous Mobile Robots (AMR) used in industrial or commercial settings.

  3. AMETEK Announces Agreement To Acquire Abaco Systems 3/22/2021

    AMETEK, Inc. (NYSE: AME) today announced that it has entered into a definitive agreement to acquire Abaco Systems, Inc., a leading provider of mission critical embedded computing systems, from Veritas Capital in an all-cash transaction valued at $1.35 billion.

  4. Highly Integrated, Galvanically Isolated Sigma-Delta Modulators From STMicroelectronics Boost Accuracy And Reliability 3/22/2021

    The STMicroelectronics ISOSD61 and ISOSD61L are high-accuracy isolated, second-order sigma-delta modulators that deliver enhanced performance and reliability in industrial applications such as motor control, electric-vehicle charging stations, solar inverters, UPS, and server and telecom power supplies.

  5. ADLINK Launches Compact SMARC AI-On-Module To Drive Industrial AI At The Edge 3/18/2021

    ADLINK Technology Inc., a global leader in edge computing, has launched the LEC-IMX8MP SMARC module, the first SMARC rev. 2.1 AI-on-Module (AIoM) that uses NXP's next-generation i.MX 8M Plus SoC for edge AI applications.

  6. MicroSys Electronics Introduces New System-On-Module With NXP LX2160A Processor 3/16/2021

    MicroSys Electronics announces an expansion to its range of ultra robust System-on-Modules in the embedded edge server class. Based on the NXP QorIQ Layerscape LX2160A processor, the new miriac MPX‑LX2160A System-on-Module (SoM) is optimized for the demanding operating conditions of commercial vehicles and mobile system.

  7. QuickLogic Joins DARPA Toolbox Initiative To Provide Mil/Aero/Defense Grade Programmable Logic 3/15/2021

    QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA IP, ultra-low power multi-core voice-enabled SoCs, and endpoint AI solutions, announced today that it has signed an agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to be an authorized supplier of embedded FPGA IP and open source FPGA tools through the DARPA Toolbox Initiative.

  8. KVH Offers TACNAV 3D With Photonic Integrated Chip Technology 3/11/2021

    KVH Industries, Inc., (Nasdaq: KVHI), announced today that the TACNAV 3D tactical navigation system is now available with the P-1775 inertial measurement unit (IMU) featuring KVH’s new photonic integrated chip (PIC) technology. KVH has been developing and testing the PIC technology for more than three years and is continuing to roll the technology into existing product lines.

  9. Moven And Digital Onboarding, Inc. Partner To Enhance Adoption Of Digital Platforms 3/8/2021

    olding the only U.S. patent for financial wellness, Moven turns data into actionable insights that improve financial health through an embedded smart-banking experience.

  10. Canonical To Pre-Certify ADLINK Devices With Ubuntu Linux Operating System 3/3/2021

    ADLINK Technology Inc., a global leader in edge computing, announced at Embedded World that it has entered into an agreement with Canonical to pre-certify ADLINK devices with the Ubuntu Linux operating system (OS) to create a complete hardware and software device offering with fully supported security and operational updates for the device lifecycle.