Brainchip And Teksun Demonstrate Rapid Adoption Of AI Solutions At Embedded Vision Summit
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, will demonstrate an accelerated prototype in partnership with Teksun in Booth No. 517 at the Embedded Vision Summit in the Santa Clara Convention Center May 22-24.
Premio Releases Newest Fanless Mini Computer Supported By AMD Ryzen Embedded Processors
Premio Inc., a global leader in rugged edge embedded computing technology, has added an AMD Ryzen embedded model to its BCO-2000 series of ruggedized fanless mini computers.
Cincoze Showcases Its Latest AIoT Solutions At Automate And COMPUTEX 2023
Rugged embedded computer brand – Cincoze, will make an appearance at two major international exhibitions in May 2023: Automate, the largest exhibition of automation in North America, in Detroit, USA on 22-25 May, and COMPUTEX, one of the largest computer and technology trade shows in the world, in Taipei, Taiwan on 30 May-2 June.
CEVA Acquires Spatial Audio Business From Visisonics To Expand Its Application Software Portfolio For Embedded Systems Targeting Hearables And Other Consumer IoT Markets
CEVA, Inc. the leading licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today announced the acquisition of the RealSpace® 3D Spatial Audio business, technology and patents from VisiSonics Corporation.
Lattice To Showcase Latest FPGA Technology In Edge AI Applications At Embedded Vision Summit 2023
Lattice Semiconductor, the low power programmable leader, today announced that it will showcase its latest FPGA technology for computer vision and Edge AI applications at Embedded Vision Summit 2023.
Mitsubishi Electric To Ship Samples Of SBD-Embedded SiC-MOSFET Module
Mitsubishi Electric Corporation announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module, featuring dual-type 3.3kV withstand voltage and 6.0kVrms dielectric strength, on May 31.
ASE Wins Device Technology Of The Year Award For Vipack™
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack™ has received the ‘Device Technology of the Year Award’ in the 2023 3D InCites Awards program.
Silicon Labs Adds MIKROE mikroSDK 2.0 Click Board Driver Support To Simplicity Studio, Speeding Software Development Time For Embedded Engineers
MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has announced that Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, has become the first IC vendor to support mikroSDK 2.0 Click drivers.
SAP To Embed IBM Watson Artificial Intelligence Into SAP® Solutions
SAP SE and IBM today announced that IBM Watson® technology will be embedded into SAP® solutions to provide new AI-driven insights and automation to help accelerate innovation and create more efficient and effective user experiences across the SAP application portfolio.
Brainchip Pushes The Edge In 2023 With Akida Innovations, Expanded Partner Ecosystem
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today reflected on its achievements in the first quarter of 2023 that saw the launch of its second-generation Akida™ processor IP platform and key partnerships with AI leaders.